Via patterning in insulating layer by soft lithography
نویسنده
چکیده
During a six months internship, the structuring of electrical vias by direct dewetting on gold substrates patterned with microcontact printing has been explored. A high modulus polymer has been tested to avoid roof collapse during the printing of the contact holes. The dewetting behaviour of potential candidates for the dielectric layer has been investigated. Conclusions: 1. Printing of the contact holes stamp without roof collapse has been obtained with a good reproducibility. Inverse filling ratios larger than 50 have been achieved for squares of 5 micron. 2. PVP (poly-(4-vinyl phenol) in EGME (ethylene glycol monomethyl ether) exhibits a sufficient contrast of wettability to allow the opening of vias in the insulated layer. However, the dewetting procedure has to be improved to allow the defectless structuring of the dielectric layer. Functional testing of the vias has not yet been performed.
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